06 Aug Molex Expands Innovative Line of NearStack High-Speed Cable Assembly Solutions to Help Customers Maximize System Performance
New NearStack 100 Ohm and 85 Ohm Solutions Address Growing Need for Increased Signal Demands
LISLE, Ill.–(BUSINESS WIRE)–Molex, a leading global manufacturer of electronic solutions, is pleased to announce the expansion of its industry-leading NearStack High-Speed Cable Solutions to include the NearStack 100 Ohm and NearStack 85 Ohm solutions. The extended portfolio helps organizations manage costs, reduce insertion loss and improve signal integrity.
Telecommunication and data center companies continue to experience increasing bandwidth requirements and, therefore, need high-density interconnects. To meet these needs, Molex continues to develop innovative connectivity solutions. One such group of solutions is the NearStack High-Speed Cable Assembly Solutions.
Tomorrow’s speeds demand smarter solutions
High-speed, high-density applications are moving away from traditional board designs to allow for high-speed lower-cost alternatives. The NearStack solutions optimize signal integrity channel performance with direct linkage, bypassing board traces and use of lower loss materials. Additionally, the NearStack solutions offer the potential to lower costs by removing re-timers and other active components from high-speed channels and reducing the numbers of high-speed layers that would need to be routed through expensive PCB materials.
“As system requirements continue to expand, signal channels extend in length as well as become more challenging to accomplish – the solutions that exist in the standard PCB world can pose challenges to clear signal transmission and be cost prohibitive. To solve these challenges, Molex is excited to offer NearStack solutions,” said Liz Hardin, group product manager. “With the addition of the NearStack 85 Ohm solution to the NearStack portfolio, we look forward to meeting additional next-generation system challenges.”
Ideal for applications requiring 100 Ohm impedance, NearStack 100 Ohm was designed as a small package, supports 56 Gbps PAM-4 and is compatible with the Molex BiPass I/O. The solution utilizes 34 AWG twinax cable to create a high-speed jumper product in 8 differential pair and 16 differential pair sizes.
In addition to the NearStack 100 Ohm solution, Molex is also introducing the NearStack 85 Ohm solution. Tuning the NearStack design to a normal impedance of 85 Ohms provides organizations with another high-speed solution to support applications requiring this impedance, such as PCIe based systems. The NearStack 85 Ohm solution uses 30 AWG twinax to enable longer reach. This NearStack connector is also compatible with Molex backplane cable assemblies.
Molex’s full suite of data center solutions targets scalability, provides high-speed support, optimizes signal integrity, offers EMI containment and thermal efficiencies. Collaborating with industry-leading technology companies, Molex is focused on supporting customer applications that meet and exceed 112 Gbps speed requirements and help in planning for next-generation demands.
For more information about NearStack High-Speed Cable Assembly Solutions, visit this link or contact us.
Molex makes a connected world possible by enabling technology that transforms the future and improves lives. With a presence in more than 40 countries, Molex offers a full range of connectivity products, services and solutions for markets that include data communications, medical, industrial, automotive and consumer electronics. For more information, visit www.molex.com.
Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
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